A measurement used in the United States and other countries as a standard method of denoting wire diameter. In AWG measurements, the larger the number is the smaller the diameter.
A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. BGA chips are easier to align to the printed circuit board, because the leads, which are called “solder balls” or “solder bumps,” are farther apart than leaded packages. Since the leads are underneath the chip, BGA has led the way to chip scale packaging (CSP) where the package is not more than 1.2x the size of the semiconductor die itself.
A term commonly used to describe assembly work other than printed circuit board (PCB) production. The electromechanical assembly process involves enclosure fabrication, installation of subassemblies and components, and routing of cabling or wire harnesses.
A thermal test method where products are powered on for extended periods to ensure product functionality.
An automated, early-stage electronics testing method for production defects.